Capacité de production de circuit imprimé

    Material : FR4,High TG FR4,Rogers,Isola,Arlon,Nelco, Halogen Free material,Aluminum board.

    Layer counts : 1-32 layers

    Finished Copper Thickness : 0.5-8 OZ

    Finished Board Thickness : 0.4-6.0 mm

    Min. Line/Track Width : 3 mil

    Min. Line/Track Space : 3 mil

    Min. Contour Tolerance : +/-0.1 mm

    Min. Finished Diameter of PTH Hole : 0.2 mm

    Max. Board Thickness/Hole Ratio : 14:1

    Min. Solder Mask Bridge : 5mil

    Min. Legend(Silkscreen) Track Width : 4mil

    Min. Legend(Silkscreen) Height : 25mil

    Min. drilling slot size : 0.2mm

    Solder mask color : green, black, blue, white, red,yellow, and matt, etc

    Solder mask hardness : 6H

    Legend/Silkscreen Color : white,yellow,black

    Dimension max : 1-2 layer = 60 X 150cm

    Dimension max : multilayer layer = 58 X 120cm

    Surface Treatment : HASL, Lead Free HASL, Immersion gold, OSP, Immersion Tin, Immersion silver, plated hard gold etc.

    Other Technology : Gold finger, peelable mask, Non-across blind/buried vias, characteristic impedance control, Rigid-flex board and Flex board etc